Study on 3-D 1T1R Resistive Random Access Memory and Stacked Array for Chiplet Integration by Parallel Electrothermal Field-Circuit Co-Simulation

Authors
Category Primary study
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Year 2026
This article has no abstract
Epistemonikos ID: 8edd3a43fd8af0b57a8a09975866a38075ef0a62
First added on: Oct 10, 2026